| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-transfer molding apparatus for package molding parts of many electronic parts provided in a lead frame in its longitudinal direction, which can suppress its failure rate when synthetic resin melt is guided through a runner groove extended in the longitudinal direction of the frame into molding cavities. SOLUTION: Flows of synthetic resin melt can be made smooth from a material filling chamber 10 into far cavities, by making larger the sectional area of a runner groove 12 as it goes away from the chamber 10, or making the sectional areas of gate ports of ones of the cavities 9 located away from the chamber than those of the gate ports of the other cavities, or increasing the number of gate ports of each cavity 9 for the cavities located away from the chamber. |
