| 摘要 |
PROBLEM TO BE SOLVED: To provide a one/face molding apparatus for chip which enables to perform plasma cleaning operation of substrates and subsequent one-face resin sealing operation for chip with high workability. SOLUTION: A plurality of substrates 1 are pushed from a magazine 11 onto aprepositional table 22, collectively picked up by means of a suction pad, and then fed to a position above a lower electrode 32 of a plasma cleaning unit C. A lid case 33 is closed, the substrates 1 are subjected to a plasma a cleaning process, collectively picked up by means of the suction pad, and then fed to a position above a lower molding die 51 of a mold press unit D. At the position, an upper molding die 55 is lowered to seal one faces of chips on the substrates 1 with resin. |
