| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method for a pattern, in particular a pattern in which a fine pattern with 10μm line/10μm space such as a liquid crystal panel is required, to obtain excellent reproducibility while preventing discontinuity in lines and a short circuit, and to provide a positive photoresist compsn. for electroless plating having excellent adhesion property with a substrate and good plating resistance to be used for the pattern forming method above described. SOLUTION: A positive photoresist compsn. containing one or more kinds of specified sulfur-contg. org. compds. (such as thiourea, thiophene, thiazole, thionalide and diphenylcarbazide) is applied on a substrate 1, dried, selectively exposed through a mask pattern 3, and developed to remove the exposed part to form a photoresist pattern 4. Then the pattern is subjected to electroless plating to form a conductive pattern 5. |
