| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can increase the reliability of elastomers formed between semiconductor chips and a TAB tape with low costs and a good appearance. SOLUTION: The method for manufacturing a ball grid array (BGA) type semiconductor device includes a step of mounting semiconductor chips on an insulating film having a plurality of wiring patterns arranged as spaced by predetermined intervals. The chip mounting step further includes a step of preparing a mold plate 20 having recesses H having a desired shape at a position where the chips are to be mounted on the insulating film and filling elastomers 4 in the recesses H of the mold plate 20, a step of subjecting the elastomers 4 to a defoaming process, a step of positioning and bonding the insulating film, a step of heating and curing the elastomers 4, a step of dismounting the mold plate 20, and a bonding step of fixedly mounting the semiconductor chips on the elastomers 4. |
