| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip supplying device, wherein the various workings such as taking-out working of a wafer holder from a magazine, elongating working of a wafer sheet and the direction correcting working for a chip on the wafer sheet are performed as a series of the workings, and these various workings can be smoothly performed in good linkage, in a die bonding device for picking up a chip on a wafer with a collet and mounting the chip on a substrate. SOLUTION: A wafer holder 6 is taken out on a lower guide member 28 at the lower side of a pushing member 26 by a moving arm. When the pushing member 26 is lowered along a feed screw 24, a wafer sheet 7 is landed on a tube body 31 and elongated. Then, a chip 8 is observed with a camera 8. By horizontally rotating the chip 8 based on the result of the observation, the direction of the chip 8 is corrected so as to agree with the direction of a collet 12. Then, the collet 12 picks up the chip 8 and mounts the chip 8 on a substrate 11.</p> |
