| 摘要 |
PROBLEM TO BE SOLVED: To precisely correct TIS components through overlay precision measurements performed within a short time. SOLUTION: The method comprises a step wherein measurements of overlay precision of a first pattern and a second parttern are performed using both of a plane view erecting image and a plane view inverted image against part of measuring points <2>, <4> and <7> alone among a plurality of points of a wafer to be measured, while measuring the overlay precision of the patterns of the other measuring points <1>, <3>, <5>, <6>, <8> and <9> by using either the plane view errecting image or the plane view inverted image. The method further comprises a step wherein calculation is performed to obtain an average value of differences between the individual measured values of the overlay precision based on the plane view errecting image and the individual measured values of the overlay precision based on the plane view inverted image of the part of the measuring points, and then, the average value is subtracted from the overlay precision measurement value at each of the measuring points <1>-<9> of the wafer to be measured for correction. |
