The module includes an assembly with at least one PCB and a housing. A semiconductor chip is provided on the face-down side of the PCB which serves as cover for the housing. An electromagnetically narrowed first section of the assembly is defined for the insertion of the semiconductor chip. The room has a cut-off frequency which is higher than the carrier frequency for microwave connections. A reception antenna structure is provided on the top surface of the PCB. A transmission antenna structure is provided on the top surface of the PCB at a different location than the reception antenna structure.
