发明名称 CHIP WITH INTERNAL SIGNAL ROUTING IN EXTERNAL ELEMENT
摘要 <p>A semiconductor chip (20) is provided with a dielectric element (50) having conductive features (56a) interconnecting electronic elements (22a, 22d) within the chip with one another. The conductive features replace internal conductors, and can provide enhanced signal propagation between elements of the chip. The conductive features on the dielectic element are connected to contacts on the chip by deformable conductive elements such as flexible leads (66) so that the dielectric element remains movable with respect to the chip. The dielectric element may have a coefficient of expansion different from that the chip itself.</p>
申请公布号 WO1998044564(A1) 申请公布日期 1998.10.08
申请号 US1998006486 申请日期 1998.04.02
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