Contactless chipcard manufacturing method

摘要

The chipcard manufacturing method uses a carrier foil provided with a conductive Cu layer, which is etched to provide a number of spaced coil structures, combined with a corresponding number of chip modules. The carrier foil is laminated with a pair of core foils positioned on either side of it and a pair of cover foils, before stamping out the individual cards, each containing a coil structure and a chip module.