Cooling device

摘要

A cooling device (1) according to the present invention, in which a space (37) is formed by means of flat electrodes (31, 32) and side plates (5, 6) disposed on the ends of the flat electrodes (31, 32), and a flexible film (4) fastened in that space (37) in a shape of the letter S, is fixed to a semiconductor package (2) so that one of the flat electrodes (31, 32) is fitted on the semiconductor package (2). The respective flat electrodes (31, 32) are alternately powered to move the S shaped section of the flexible film (4).