发明名称 |
Composition and process for forming electrically insulating thin films |
摘要 |
<p>Herein we provide a composition for the formation of insulating films that have a low dielectric constant. The composition comprises (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) at least two solvents: (B)(i) a solvent capable of dissolving resin (A) and (B)(ii) a solvent whose boiling point or vapor pressure curve differs from that of solvent (B)(i) or whose affinity for resin (A) differs from that of solvent (B)(i). Also claimed is a method for forming a insulating films that have a dielectric constant of less than 2.7.</p> |
申请公布号 |
EP0869515(A1) |
申请公布日期 |
1998.10.07 |
申请号 |
EP19980105809 |
申请日期 |
1998.03.30 |
申请人 |
DOW CORNING TORAY SILICONE COMPANY, LIMITED |
发明人 |
KOBAYASHI, AKIHIKO;MINE, KATSUTOSHI;NAKAMURA, TAKASHI;SASAKI, MOTOSHI;SAWA, KIYOTAKA |
分类号 |
C08L83/06;C08G77/12;C04B41/49;C04B41/84;C08L83/05;C09D183/04;C09D183/05;C09D183/06;H01B3/46;H01L21/312;H01L21/314;H01L21/316;H01L21/768;H01L23/522;(IPC1-7):H01B3/46;C04B41/50 |
主分类号 |
C08L83/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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