| 摘要 |
Multiple I/O pads are arranged in a pattern on a surface of an integrated circuit package, and an obstruction in the package prevents a planer solder flux mask from lying flat on the surface around the I/O pads. Such an obstruction can, for example, be a lid in the package which projects above the I/O pads, or it can be an encapsulant which covers a chip in the package and projects above the I/O pads. Despite the presence of the obstruction, solder flux is dispensed on the I/O pads of the integrated circuit package by the steps of -a) providing a pin block that has a base from which multiple pins project, and the ends of the pins match the pattern of the I/O pads; b) coating the ends of the pins with a solder flux; and, c) transferring a portion of the solder flux from the ends of the pins to the I/O pads by temporarily touching the coated ends of the pins against the I/O pads. During this transferring step, the coated ends of the pins are moved past the obstruction and touched against the I/O pads without touching the obstruction.
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