发明名称 Surface acoustic wave device
摘要 A surface acoustic wave device of the present invention includes piezo-electric substrates 1 and 2 each having one surface formed with interdigital electrodes 12A, 12B, for transmission and receiving of surface acoustic waves, are received in a casing including a stem 4, a seal ring 9 and a cover plate 5, etc. The piezo-electric substrates 1 and 2 are arranged such that the one surfaces thereof face each other with a predetermined space therebetween and electrically conductive members 3 are disposed between the piezo-electric substrates 1 and 2. The electrically conductive members 3 may be gold bumps, solder bumps, metal balls of such as solder or copper, electrically conductive adhesive members or electrically conductive rubber members, etc. The surface acoustic wave device is applicable to such as filters and featured by having small mounting area and easiness of manufacture.
申请公布号 US5818145(A) 申请公布日期 1998.10.06
申请号 US19960629433 申请日期 1996.04.09
申请人 NEC CORPORATION 发明人 FUKIHARU, EIICHI
分类号 H03H9/145;H03H9/05;H03H9/25;(IPC1-7):H03H9/25;H01L41/08 主分类号 H03H9/145
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