发明名称 RESIN COMPOSITION FOR CURED PRODUCT OF LOW THERMAL EXPANSION AND COMPOSITE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which exhibits a curing shrinkage factor of a specific value or less and can be used for producing a cured product exhibiting a thermal expansion coefficient from room temperature to a high temperature of an almost the same level as that of steel, by compounding an unsaturated polyester, diallyl phthalate, a thermoplastic resin having a glass transition temperature of a specific temperature or lower, a polymerization initiator and an inorganic filler. SOLUTION: Disclosed is a resin composition which comprises an unsaturated polyester, diallyl phthalate, a thermoplastic resin having a glass transition temperature of 150 deg.C or lower, a polymerization initiator and an inorganic filler, and exhibits a curing shrinkage factor of 0.1% or less and affords a cured product exhibiting a thermal expansion coefficient from room temperature to 300 deg.C of 0.7×10<-5> to 1.5×10<-5> / deg.C. An unsaturated polyester having a high melting point of 130 to 180 deg.C and the one prepared by polymerizing 1,4- butanediol and/or cyclohexane dimethanol, terephthalic acid (or an ester thereof) and fumaric acid are preferably used. It is preferred that an inorganic filler is used in a ratio of 75 to 95 wt.% based on the resin composition.
申请公布号 JPH10265662(A) 申请公布日期 1998.10.06
申请号 JP19970072142 申请日期 1997.03.25
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 MATSUI FUMIO;MORITA KATSUHISA;NAKAJIMA HIROSHI;HOSHINO TOSHIAKI
分类号 C08K5/10;C08F283/01;C08K9/10;C08L23/04;C08L25/04;C08L33/12;C08L67/06;(IPC1-7):C08L67/06 主分类号 C08K5/10
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