发明名称 RESIN COMPOSITION FOR BONDING, LAMINATE AND MULTILAYER DRAW-FORMED MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition having improved processability, adhesivity and thermal stability by including a modified ethylene-α-olefin copolymer, an ethylene-based polymer, a tackifier and a hydrogenated block copolymer of a specific compound at specific ratios. SOLUTION: This composition is composed of (A) 1-97 wt.% of a modified ethylene-α-olefin copolymer modified with an unsaturated carboxylic acid (derivative), containing 0.01-20 wt.% of the modifying carboxylic acid and having a density of 0.85-0.875 g/cm<3> , (B) 1-97 wt.% of an ethylene-based polymer having a melt-flow rate of 0.05-50 g/10 min and a density of 0.85-0.950 g/cm<3> , (C) 1-50 wt.% of a tackifier and (D) 1-97 wt.% of a hydrogenated block copolymer of a vinyl aromatic compound and a conjugated diene compound. A laminate useful as a food-packaging material, etc., can be produced by using a layer of the above composition and a layer of a thermoplastic resin selected from a saponified ethylene-vinyl acetate copolymer having an ethylene content of 15-65 mol% and a saponification degree of >=90%.
申请公布号 JPH10265751(A) 申请公布日期 1998.10.06
申请号 JP19970073926 申请日期 1997.03.26
申请人 MITSUBISHI CHEM CORP 发明人 IKEDA MUTSUKO
分类号 B32B27/00;C09J123/04;C09J123/26;C09J153/02;(IPC1-7):C09J123/26 主分类号 B32B27/00
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