发明名称 RESIN COMPOSITION FOR BONDING AND LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a bonding resin composition exhibiting excellent adhesive force between the layers of a laminate containing polyester resin layer and provide a laminate produced by using the composition. SOLUTION: This bonding resin composition contains (A) 50-99 wt.% of an ethylene-α-olefin copolymer having a melt-flow rate of 0.1-50 g/10 min and a density of 0.850-0.900 g/cm and (B) 1-50 wt.% of a tackifier consisting of a hydrogenated aromatic hydrocarbon resin having an <A1>/<A2> ratio of 0.1-3.0 wherein <A1> and <A25 are absorbance values measured by an infrared spectrophotometer at 1604 cm<-1> and 890 cm<-1> , respectively. The laminate is composed of a polyester resin layer (the layer A) and a layer composed of the above bonding resin composition (the layer B).
申请公布号 JPH10265750(A) 申请公布日期 1998.10.06
申请号 JP19970073929 申请日期 1997.03.26
申请人 MITSUBISHI CHEM CORP 发明人 IKEDA MUTSUKO
分类号 B32B27/00;B32B27/28;B32B27/32;B32B27/34;B32B27/36;C09J123/08;C09J125/00;(IPC1-7):C09J123/08 主分类号 B32B27/00
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