| 摘要 |
PROBLEM TO BE SOLVED: To realize the mass-production of a low cost IC card by a method wherein no frame is employed for manufacturing the IC card and yet no poor function of the IC card is realized. SOLUTION: An IC module A is produced by connecting a circuit board 1, on which an IC is mounted, with a coil 4 for transmitting and receiving data. A softener for softening a flexible plastic sheet 6 is applied onto the surface, on which the IC is mounted, of the IC module A. Under the condition that a flexible plastic sheet 6 is faced to the surface, on which the softener is applied, of the IC module, the IC module A is buried in the flexible plastic sheet 6 with a first hot press. Onto both the sides of the flexible plastic sheet 6, in which the IC module is buried, insulating rigid decorative sheets 7 and 8 and transparent protective sheets 9 and 10 are laminated with a second hot press so as to manufacture an IC card. |
