发明名称 Method of reducing carbon incorporation into films produced by chemical vapor deposition involving organometallic precursor compounds
摘要 A semiconductor processing method of depositing a film on a substrate using an organometallic precursor, where the precursor comprises a coordination complex having a central linking atom and at least two ligands bonded thereto, at least one of the ligands including an organic species comprising a carbon atom having at least one hydrogen atom bonded thereto thereby defining a carbon-hydrogen bond of the species, includes, a) passing a feed material through a plasma generating location effective to induce the feed material into a plasma state; b) flowing the feed material from the plasma generating location, the feed material flowing from the plasma generating location comprising a gas in an activated metastable state; c) combining an organometallic precursor with the gas when the gas is in the activated metastable state to separate the organic species from the organometallic precursor coordination complex while leaving the carbon-hydrogen bond intact, the organometallic precursor being in a gaseous non-plasma state when combined with the activated metastable state gas; and d) passing the combined precursor and gas to a substrate under conditions effective to deposit a film on the substrate, the film comprising the central linking atom.
申请公布号 US5817175(A) 申请公布日期 1998.10.06
申请号 US19950506535 申请日期 1995.07.25
申请人 MICRON TECHNOLOGY, INC. 发明人 IYER, RAVI
分类号 C23C16/18;C23C16/34;C23C16/452;C30B25/10;(IPC1-7):C30B25/02 主分类号 C23C16/18
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