| 摘要 |
A wire bonding apparatus comprises an X-Y table for placing thereon a die pad, on which a rectangular semiconductor chip with a plurality of first bonding pads is mounted, and a package component with a plurality of second bonding pads, a bonding tool for bonding, using a wire, each of the first bonding pads to a corresponding one of the second bonding pads, the bonding tool being movable between a reference position and a bonding level in a Z-direction, a camera system having an auto-focusing function for detecting the Z-directional position of each of the first and second bonding pads, thereby creating Z-directional data concerning the first and second bonding pads, a bonding level computer for calculating bonding levels of the bonding tool on the basis of the Z-directional position data, a bonding sequence computer for determining the motion sequence of the bonding tool on the basis of the calculated bonding levels, and a position/load control selector for selecting, on the basis of the determined motion sequence, a type of control of the bonding tool such that position control is performed while the tool is moved, and load control is performed while the tool performs bonding.
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