发明名称 Apparatus and method for cooling an electrical component
摘要 The apparatus includes a flexible printed wiring device (18) having a region sized to receive the electronic component (10) and a channel (28) disposed within the flexible printed wiring device. The channel has an inlet end (32) and an outlet end (34) and has an orifice (36) disposed therein. The inlet end receives a fluid, the fluid is distributed to the orifice via the channel and the orifice directs the fluid toward the region, so that the fluid is in direct contact with the electronic component when the electronic component is disposed in the region.
申请公布号 US5818692(A) 申请公布日期 1998.10.06
申请号 US19970865811 申请日期 1997.05.30
申请人 MOTOROLA, INC. 发明人 DENNEY, JR., DONALD L.;PAIS, MARTINHO R.
分类号 H01L23/473;H05K1/18;H05K7/20;(IPC1-7):H65J7/20 主分类号 H01L23/473
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