| 摘要 |
In a vapour deposition process of forming an electrical circuit on an insulating base such as glass a bonding layer such as nickel chrome, chromium, iron or nickel is first deposited, followed by at least three layers of a metal of high conductivity such as gold, the temperature of the base being reduced for each successive deposition and the thickness of each successive layer of gold increasing. The glass base is masked and nickel chrome is deposited to a thickness of 70-80</>rA with the glass base at 300-350 DEG C. A second mask to give the required conductive pattern is now placed over the substrate and a coating of nickel chrome up to 300</>rA is deposited, the glass being at 300 DEG C. The gold layers are now deposited using the same mask, layer 1 of 50</>rA thickness with the base at 300 DEG C., layer 2 of 150</>rA thickness with the base at 150 DEG C., and layer 3 of 1500</>rA thickness with the base at 20 DEG C. Gold leads are bonded to the gold layers by hot pressing in a stream of hot inert gas, the deposited layer being first preheated by the hot gas. |
