| 摘要 |
PURPOSE:To enable bonding easily a with simultaneous inspection by extracting frames, bonding of which is completed, again and inspecting the state of bonding in a bonder, in which each semiconductor part is bonded and the frames are housed in a frame housing means. CONSTITUTION:A push mechanism 121 projecting lead frames L/F in a magazine M loaded onto an up and down member 44 one by one with the operation of a positioning means is disposed on the side of the up and down member 44 installed to the positioning means. A pusher 126 is reciprocated through a belt 124 by the forward and reverse rotation of a motor 122 in the push mechanism 121, and the lead frames L/F are pushed out to the outside of the magazine M when the pusher 126 is reciprocated. Inspection is conducted by using each substrate conveyor 131, 132, 138. Accordingly, inspection can be completed together with a bonding process, thus allowing the inspection of products without separately mounting an inspection device. |
