| 摘要 |
PURPOSE:To prevent a bonding wire from coming off from the clamping surface of an IC wire bonder and, at the same time, to prevent the clamping surface from being scratched by the bonding wire. CONSTITUTION:This bonder is provided with a hollow cylindrical wire supplying section 11 through which a bonding wire 3 is passed along its axial center and a collet-like clamping section 8 which is provided at the lower end of the section 11 and the wire clamping surface of which is equally divided into a plurality of parts respectively having the same circular arc surfaces as the external size of the wire. The bonder is also provided with a coil spring 10 which generates a clamping load against the wire 3, guide 9 having a tapered hole into which the section 8 is inserted, and wire clamper provided with a cylinder which moves the section 11 and opens and closes the section 8 by using the tapered hole. The clamping section 8 is made to have a collet chuck structure which is divided into, for example, two or four parts. |
