| 摘要 |
<p>A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid (T) or liquid-like fluid (T) near its supercritical temperature, where the resulting atomized or vaporized solution (N) is entered into a flame or a plasma torch (170), and a powder is formed or a coating is deposited onto a substrate (190). The combustion flame (170) can be stable from 10 torr to multiple atmospheres, and provides the energetic environment in which the reagent contained within the fluid (T) can be reacted to form the desired powder or coating material on a substrate (190). The plasma torch likewise produces the required energy environment, but, unlike the flame, no oxidizer is needed so materials stable in only very low oxygen partial pressures can be formed. Using either the plasma torch or the combustion flame (170), coatings can be deposited and powders formed in the open atmosphere without the necessity of a reaction chamber, but a chamber may be used for various reasons including process separation from the environment and pressure regulation.</p> |
