| 摘要 |
<p>PURPOSE:To eliminate the need for a masking process, etc., so as to simplify the manufacturing work of a reflection type photocoupler by mounting a light emitting element on a package formed in two colors of conductive resin bodies and insulating resin bodies and electrically connecting the light emitting element on the upper surface of the package to lower-surface terminals formed on the lower surface of the package. CONSTITUTION:A package 21 is formed by integrally molding four highly conductive resin bodies 31, 33, 32, and 34 and insulating resin bodies 35 put between each body 31, 33, 32, and 34 by means of metallic mold and elements 22 and 24 are mounted on the upper surface of the package 21, with the peripheries of the elements 22 and 24 being sealed with a light transmitting resin 27. Therefore, the manufacturing process of this photocoupler can be simplified and part of the process can be omitted, because the need of forming three-dimensional wiring on the surface of the through, etc., of the package 21 which has been formed in the conventional example in order to secure electric connection between the elements 22 and 24 and lower-surface terminals 37 and 41 on the lower surface of the package 21 is eliminated. In addition, since no through hole is required and the metallic mold can be simplified in shape, the molding can be performed easily and the cost of the metallic mold can be reduced.</p> |
