| 摘要 |
PROBLEM TO BE SOLVED: To prevent a conductor layer and an interlayer resin insulating layer from separating off from each other and to protect the interlayer resin insulating layer against cracking under environmental conditions such as thermal cycles or high-temperature and high-humidity, by a method wherein a roughened layer is formed on a part of the latticed surface of the conductor layer. SOLUTION: A copper plated laminated board composed of a board which is 0.6 mm thick and formed of glass epoxy resin or bismaleimide triazine resin and copper foils 18μm thick and formed on both the sides of the board is made to serve as a starting material. The board where an inner copper pattern is formed is rinsed, dried out, degreased with acid, subjected to soft etching, and treated with a catalytic solution composed of palladium chloride and organic acid to be given Pb catalyst. Then, the Pb catalyst is activated, and the board is plated using an electroless plating bath of pH9 composed of copper sulfate 15 g/l, nickel sulfate 0.6 g/l, citric acid 15 g/l, sodium hypophosphite 29 g/l, boric acid 31 g/l, and surface-active agent 0.1 g/l, whereby a roughed layer (rugged layer) 5 of Cu-Ni-P alloy 25μm thick is formed on all the surface of a copper conductor circuit. |
