| 摘要 |
A solder, e.g. tin-lead, mound is formed on an integrated circuit member by placing a mask around a land which may be a Au, Cu, Cr laminate, vapour depositing the solder on the land, removing the mask, and then heating under a flux or in a reducing atmosphere to melt the solder and cause it to draw up into a mound, due to the surface tension effect. |
