Selectively filled adhesives for semiconductor chip interconnection and encapsulation
摘要
Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a noble metal at a high current density.
申请公布号
US5813870(A)
申请公布日期
1998.09.29
申请号
US19960678852
申请日期
1996.07.12
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
GAYNES, MICHAEL ANTHONY;MOLLA, JAYNAL ABEDIN;OSTRANDER, STEVEN PAUL;ROLDAN, JUDITH MARIE;SAXENMEYER, GEORGE JOHN;WALKER, GEORGE FREDERICK