发明名称 |
Method for cleaning a semiconductor wafer with an improved cleaning solution |
摘要 |
A method for removing metallic and organic contaminations from a surface of a semiconductor wafer comprises cleaning the semiconductor wafer with a cleaning solution which contains a chlorine compound acting as an oxidant and which has a pH value in the range of 1 to 3. The cleaning solution has an oxidation-reduction potential in the range of 800 mV to 1200 mV when measured on the basis of a saturated calomel electrode at a temperature 25 DEG C.
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申请公布号 |
US5814157(A) |
申请公布日期 |
1998.09.29 |
申请号 |
US19960645812 |
申请日期 |
1996.05.14 |
申请人 |
NEC CORPORATION |
发明人 |
MIZUNIWA, TETSUO;SHIRAMIZU, YOSHIMI |
分类号 |
C11D7/10;B08B3/08;C11D7/00;C11D11/00;H01L21/00;H01L21/304;H01L21/306;H01L21/308;(IPC1-7):C23G1/02 |
主分类号 |
C11D7/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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