发明名称 |
Semiconductor component |
摘要 |
A semiconductor component has at least one semiconductor chip mounted on a carrier part of its housing. The semiconductor chip is electrically connected to at least two electrode connectors which are provided with contacts. The component housing has an upper housing portion and at least one housing side part which surround the semiconductor chip at least partially. The carrier part on which the semiconductor chip is mounted forms the upper housing portion of the component housing and the at least two electrode connectors at least partially form the housing side parts of the component housing. |
申请公布号 |
US5814870(A) |
申请公布日期 |
1998.09.29 |
申请号 |
US19970779366 |
申请日期 |
1997.01.06 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
SPAETH, WERNER |
分类号 |
H01L23/12;H01L31/0203;H01L33/48;H01L33/52;H01L33/58;H01L33/62;(IPC1-7):H01L31/020 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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