| 摘要 |
PROBLEM TO BE SOLVED: To prevent a conductor filling printing which fills up a through-hole with conductor from being displaced with a conductor pattern printing, by a method wherein a through-hole is bored in a ceramic green sheet, and a conductor filling printing and a conductor pattern printing are performed onto a ceramic green sheet using a reference hole. SOLUTION: A pre-positioning hole e which is used when a through-hole c is bored is bored in a ceramic greed sheet a. Then, the ceramic green sheet a is positioned and fixed at the work holder of a boring machine, and the through-hole c and a reference hole d used for carrying out a conductor filling printing and a conductor pattern printing are bored in the ceramic green sheet a. Then, the ceramic green sheet a is positioned and fixed on the work pad of a printer using the reference hole d, a conductor filling printing and a conductor pattern printing are carried out, and furthermore ceramic green sheets a are laminated by the use of the reference hole d. By this setup, the through- hole c, conductor filling printing, and conductor pattern printed can be prevented from being displaced with each other, and this a multilayer ceramic board of high accuracy can be obtained. |
