发明名称 POSITIVE PHOTORESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a chemically sensitized positive photoresist composition superior in storage stability and constituent solubility and coating uniformity free from occurrence of coating trouble, such as coating residues and striations by incorporating a compound to be decomposed by acid and increased in solubility in an alkaline developing solution and an acid photogenerator and an alkoxy butyl acetate. SOLUTION: This positive photoresist composition comprises the compound having a group to be decomposed by action of an acid and raised in solubility in the alkaline developing solution and the compound to be allowed to release an acid by irradiation with activated rays or radiation, and the alkoxy-butyl and/or-pentyl acetate, embodied by 3-methoxybutyl acetate, and the group to be decomposed by action of the acid and to be raised in solubility in the alkaline developing solution is embodied by one of tertiary alkyl esters and acetals and silyl ethers.
申请公布号 JPH10260533(A) 申请公布日期 1998.09.29
申请号 JP19970063366 申请日期 1997.03.17
申请人 FUJI PHOTO FILM CO LTD 发明人 YAMANAKA TSUKASA;YOSHIMOTO HIROSHI
分类号 G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/039 主分类号 G03F7/004
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