| 发明名称 |
Packaged semiconductor chip |
| 摘要 |
A semiconductor device includes a substrate having a recess; a semiconductor chip disposed in the recess; a plurality of external electrodes disposed on the substrate; a lid covering the recess; and a heat radiator disposed between the semiconductor chip and the substrate for transmitting heat generated by the semiconductor chip to the substrate for radiation. |
| 申请公布号 |
US5814883(A) |
申请公布日期 |
1998.09.29 |
| 申请号 |
US19960640504 |
申请日期 |
1996.05.01 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA;RYODEN SEMICONDUCTOR SYSTEM EENGINEERING CORPORATION |
发明人 |
SAWAI, AKIYOSHI;ONO, KISAMITSU;ICHIYAMA, HIDEYUKI;ASAI, KATSUNORI |
| 分类号 |
H01L23/12;H01L23/04;H01L23/367;(IPC1-7):H01L23/12;H01L23/48;H01L23/38;H01L23/36 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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