LEAD FRAME, METAL MOLD FOR RESIN SEALED SEMICONDUCTOR DEVICE USING LEAD FRAME, RESIN SEALED SEMICONDUCTOR DEVICE USING LEAD FRAME, AND MANUFACTURE OF RESIN SEALED SEMICONDUCTOR DEVICE,申请号JP19980009086-传众专利搜索

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发明名称	LEAD FRAME, METAL MOLD FOR RESIN SEALED SEMICONDUCTOR DEVICE USING LEAD FRAME, RESIN SEALED SEMICONDUCTOR DEVICE USING LEAD FRAME, AND MANUFACTURE OF RESIN SEALED SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH10261751(A)	申请公布日期	1998.09.29
申请号	JP19980009086	申请日期	1998.01.20
申请人	MATSUSHITA ELECTRON CORP	发明人	TAKADA KOJI;YOKOZAWA MASAMI;YOSHIDA HIROYOSHI;SAKAGUCHI SHIGEKI
分类号	H01L23/28;H01L21/56;H01L23/50;(IPC1-7):H01L23/50	主分类号	H01L23/28
代理机构		代理人
主权项
地址

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