SEMICONDUCTOR ELEMENT MULTILAYER INTERCONNECTION AND ITS MANUFACTURE,申请号JP19970066939-传众专利搜索

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发明名称	SEMICONDUCTOR ELEMENT MULTILAYER INTERCONNECTION AND ITS MANUFACTURE
摘要
申请公布号	JPH10261708(A)	申请公布日期	1998.09.29
申请号	JP19970066939	申请日期	1997.03.19
申请人	OKI ELECTRIC IND CO LTD	发明人	NAKAMURA MAKIKO
分类号	H01L23/522;H01L21/768;(IPC1-7):H01L21/768	主分类号	H01L23/522
代理机构		代理人
主权项
地址

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