| 摘要 |
PROBLEM TO BE SOLVED: To provide a package body wherein a semiconductor chip package is made light, thin and short and productivity can be improved by omitting a wire bonding process, and a semiconductor chip package using the package body. SOLUTION: A package body is composed of a first cavity 11 recessed in the upper surface of a package body main body 10, a second cavity 12 recessed in the bottom surface of the first cavity 11, and a plurality of metal patterns 13 continuously connecting the bottom surface of the second cavity 12 with the lower surface of the package body main body 10. A semiconductor chip package is constituted by installing a semiconductor chip 20 which is continuously connected with the package main body 10 and each of the metal patterns 13 and whose bumps 40 are formed on a plurality of bonding pads 30, a sealing part 60 with which the second cavity 12 is filled, and a molding part 70 with which the first cavity 11 is filled. |
