| 摘要 |
PROBLEM TO BE SOLVED: To continuously and automatically process even an irregular cut wafer similar to a regular wafer by performing the setting to a carrier, carrying through a loader and an unloader, and testing at a test section of a wafer, while holding by a planar auxiliary jig. SOLUTION: A plurality of wafers 1 are set, while being mounted one by one on an auxiliary jig 10, in a regular carrier 2 together with the auxiliary jig 10. The auxiliary jig 10 mounting the wafer 1 is then taken out sequentially one by one by means of a loader 3, e.g. a rubber belt, and mounted on a test stage 5 where it is subjected to image processing by means of an image processor 11. Subsequently, the test stage 5 which mounts the auxiliary jig 10 mounted with the wafer 1 is carried, by means of the loader 3, to a tester section 4 where wafer tests including measurements of brightness, forward voltage, reverse voltage, and the like, are performed using a light-emitting element 6 and a measuring piece 7. After ending the tests, the wafer 1 is carried out, together with the auxiliary jig 10 to a carrier 9 the carrying-out side by means of an unloader 8. |
