发明名称 |
Grounding for enclosures |
摘要 |
An apparatus is provided to reduce the amount of EMI generated by a circuit. The grounding of an enclosure is improved by providing a number of shaped protuberances, the protuberances having an end that penetrates a conductive region of a circuit board, such that when the circuit board is mounted to the support member, the protuberances make a penetrating electrical contact and provides for additional ground paths, thereby reducing the EMI generated by the assembly.
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申请公布号 |
US5814762(A) |
申请公布日期 |
1998.09.29 |
申请号 |
US19960687306 |
申请日期 |
1996.07.25 |
申请人 |
DIGITAL EQUIPMENT CORPORATION |
发明人 |
TUSLER, RALPH MICHAEL;LEWIS, MARK S.;MARTINEZ, REUBEN |
分类号 |
H05K7/14;H05K9/00;(IPC1-7):H05K9/00 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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