| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition capable of forming a molded product having sufficient mechanical characteristics, heat resistance and dimensional accuracy free from deformation with time, especially suitable for optically three-dimensional molding, holographic three-dimensional molding, etc. SOLUTION: This photosensitive resin composition comprises (A) a metallocene compound having light absorption at 400-700nm wavelength, especially bis(η<5> -2,4-cyclopentadien-1-yl)-bis[2,6-difluoro-3-(pyrrol-1-yl)phenyl]titan ium, (B) a nitrogen-containing vinyl compound having >=80 deg.C glass transition temperature of a homopolymer and (C) a urethane (meth)acrylate oligomer containing two or more ethylenic unsaturated groups. |
