| 摘要 |
PCT No. PCT/US95/03607 Sec. 371 Date Dec. 2, 1996 Sec. 102(e) Date Dec. 2, 1996 PCT Filed Mar. 21, 1995 PCT Pub. No. WO95/25603 PCT Pub. Date Sep. 28, 1995A coating composition comprising a glue, a particulate material and a solvent, which imparts a surface microstructure to a coated object (29) is disclosed. The particulate material projects above the glue line (28) of the coated object creating the microstructure which provides boiling heat transfer enhancement. A horizontally oriented, rectangular surface immersed in FC-72, indicates up to an 85% decrease in incipient superheat, a 70% to 80% reduction in nucleate boiling superheats, and a DIFFERENCE 109% increase in the critical heat flux (CHF), beyond that of the non-painted surface. The enhanced surface heat transfer coefficients are four to nine times higher than those from the reference surface. The coatings are applicable to electronic component surfaces. A coated silicon test chip tested at subcooled (45 DEG C. conditions using FC-72 had heat dissipation rates of DIFFERENCE 100 W/cm2 at junction temperatures of DIFFERENCE 85 DEG C., and the highest CHF observed was 159 W/cm2, 224% higher than that from the untreated chip surface at saturated conditions.
|
