| 摘要 |
An apparatus for cutting and desplicing a roll of spliced films, being transported through the apparatus, to form filmstrip leading and trailing ends and re-shaping each end to their desired configurations having, a splice cutter located along the film path for forming two filmstrip ends with residual splices thereon, punch and die assemblies located adjacent to the splice cutter for re-shaping the ends of the filmstrip and removing the residual splice, moveable alignment guides located adjacent to each punch and die assembly, for aligning the film prior to cutting and re-shaping operations, a plurality of flexible guides located along the film path for guiding the spliced and despliced films along the film path, and an aperture located below the splice cutter, underneath the film path, for disposing of the removed residual splices, is described. A method for cutting and re-shaping the ends of a filmstrip using the apparatus is also described.
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