| 摘要 |
PROBLEM TO BE SOLVED: To prevent sealing-resin formation failures, such as resin unfilled state and the occurrence of void in manufacture of resin-sealed semiconductor device, and to reduce sealing-resin injection period without adversely affecting a metal mold and a resin sealed body. SOLUTION: The opening area of a gate 5 as a sealing-resin inlet port 5a to a cavity 3 is increased, and the gate 5 is made freely openable/closable. The opening area of the gate 5 is changed, based on at least one of signals from a flow velocity sensor 7 and a pressure sensor 9, and the flow velocity of sealing resin 4 is controlled for each cavity 3. |
