| 摘要 |
PROBLEM TO BE SOLVED: To cope with an increase in the number of terminals more than ever, by forming the external terminals of a circuit section directly on one side of a conductive substrate by electrolytic plating, and forming leads on an insulating epoxy resin layer, excepting an external terminal formation region, by transfer molding. SOLUTION: A circuit member 100 for semiconductor devices has a conductive substrate 120 composed of stainless steel; a circuit section 110 composed of conductive copper material, formed on the conductive substrate 120 by plating; and an insulating epoxy resin layer 140 formed by transfer molding, and is provided with a jig hole 130 for ensuring positional accuracy during the manufacturing process. The circuit section 110 comprises die pads 111, leads 112, 112A, and an external terminal section 113 integrally coupled with the leads 112. The sets of the leads 112, external terminal section 113 and leads 112A are independent, and two-dimensionally arranged along the plane of the circuit section 110. Thereby an increase in the number of the terminals on a semiconductor device can be coped with. |
