| 摘要 |
PROBLEM TO BE SOLVED: To inspect whether a via hole is correctly opened or not, with no upgraded precision in positioning when a via hole is formed. SOLUTION: On a semiconductor substrate 2, an inspection wiring 3 used for inspecting opening of a via hole 6 is formed, and an insulating film 4 is formed on the inspection wiring 3. To the inspection wiring 3, two wire holes are so allocated that a bottom surface touches both the inspection wiring 3 and the insulating film 4. Respective via holes 6 are allocated on both ends of the inspection wiring 3, while being mutually displaced in the opposite direction to wiring-width direction of the inspection wiring 3. |
