发明名称 GROUND REINFORCING METHOD OF PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To reinforce the ground of a printed wiring board through a metallic housing, by connecting electrically connectors with the ground pattern of the printed wiring board, and by making on the metallic housing build-up portions for connector insertions, and further, by inserting the build-up portions into the connectors of the printed wiring board to connect the build-up portions with the connectors. SOLUTION: On the solder surface side of a printed wiring board 1, an IC 2 and other parts 3 are mounted, and edge connectors 7, 8 are mounted on the arbitrary places of a ground (GND) pattern present on the opposite surface side to the solder surface of the printed board 1. Then, to the opposite surface side, a plate metal 6 is applied instead of a metallic housing. In the plate metal 6, a build-up portion 10a and build-up portions 10b are formed correspondingly to the place of a screwing hole 9 and the places of the edge connectors 7, 8. When putting the printed wiring board 1 on the plate metal 6, the vertical build-up portions 10b present on the plate metal 6 are inserted into the edge connectors 7, 8 to be connected electrically with them, and in the build-up portion 10a, a setscrew 5 is screwed through the screwing hole 9, and electrical connections are performed at the four corners of the board 1.
申请公布号 JPH10256683(A) 申请公布日期 1998.09.25
申请号 JP19970060913 申请日期 1997.03.14
申请人 CANON INC 发明人 INAGAWA HIDEHO;TERAYAMA YOSHIMI
分类号 H05K1/02;H05K1/05;H05K3/00;H05K3/40;(IPC1-7):H05K1/02 主分类号 H05K1/02
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