| 摘要 |
PROBLEM TO BE SOLVED: To prevent a conductive film from being peeled by providing a buffer layer between a substrate and the conductive film. SOLUTION: A buffer layer 700 is provided on a substrate 11 that is constituted, for example, by performing the press machining and extrusion method of, for example, an insulation material using the high-vacuum deposition method and the sputtering method, and a conductive film 12 is formed on the buffer layer 700 by the plating method and the sputtering method. Also, a groove 13 that is provided at the substrate 11, the buffer layer 700, and the conductive film 12 is formed by applying laser beams to the conductive film 12 or applying a whetstone to the conductive film 12. Then, for example, an epoxy resin is applied to a part where the groove 13 of the substrate 11, the buffer layer 700, and the conductive film 12 is provided. The components of the buffer layer 700 are for example, a conductive metal material single substance such as Cr, Ni, Cu, Ag, and Ti or a metal material consisting of at least two of the metal materials. The buffer layer 700 is approximately as thick as severalÅ-1μm, thus, improving the adhesion strength between the conductive film 12 and the substrate 11.
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