| 摘要 |
PROBLEM TO BE SOLVED: To provide the technology, which can perform the positioning of a semiconductor device of a surface mounting type and can prevent the deviation after the positioning in high accuracy. SOLUTION: Protruding parts 2, which are protruding from the mounting surface of a lead 3, are provided at the surface of a surface-mounting type semiconductor device facing a mounted substrate. The position alignment of the semiconductor device and the mounted substrate is performed by the engagement of positioning holes provided in correspondence with the protruding parts 2 and the protruding parts 2. Thus, the semiconductor device is attached to the accurate position on the mounted substrate by the protruding parts and the positioning holes, and the position can be fixed. Therefore, the positioning can be simplified, and the deviation of the semiconductor device after the positioning can be prevented. |
