发明名称 ELECTRONIC COMPONENT MOUNTING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting method and apparatus which can eliminate the need for such troublesome works as the alignment of electronic components in a supply direction in a part supply section for setting. SOLUTION: An image pickup recognition device 10 recognizes the sucked state of an electronic component 4 to a nozzle 6, as well as the position (angle) of a polarity indication part of the electronic component. A calculation controller 11 compares information obtained by the recognition device 10 with information previously stored in a memory 8 and calculates a correction with respect to a deviation in the sucked attitude of the electronic component to the nozzle 6 and a correction, with respect to a shift of the electronic part from the polarity position in a supply direction (angle), in order to correctly mount the electronic component 4 at a predetermined position on a circuit board. On the basis of the two types of corrections, a drive controller 12 controllably corrects the attitude of the part 4 sucked to the nozzle 6, as well as the supply direction (angle) thereof, moves a nozzle 6, and then mounts the part 4 at a predetermined position on a circuit board.
申请公布号 JPH10256793(A) 申请公布日期 1998.09.25
申请号 JP19970054941 申请日期 1997.03.10
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OGATA HIROSHI;OBARA HIROSHI;YAZAWA TAKASHI;UCHIYAMA HIROSHI
分类号 B23P21/00;H05K13/04;H05K13/08 主分类号 B23P21/00
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