SENSOR DEVICE AND ITS MANUFACTURE AS WELL AS LEAD FRAME USED FOR MANUFACTURE OF THE SAME

摘要

PROBLEM TO BE SOLVED: To realize a package structure in which the detecting axis of a transducer chip can be set in an arbitrary direction and which has a lead shape capable of being mounted on a circuit board in a stable state and to realize a reduction is production costs at the same time. SOLUTION: An accelerometer 5 which is mounted on a circuit board 4 has a shape in which a group of first leads 7 and one pair of second leads 8 protrude from both sides at the base part of a longitudinal resin-molded package 6. An island 10 at a lead frame is arranged inside the molded package 6 in a state that its chip mounting face is at right angles to the mounting face of the circuit board 4, and an accelerometer chip 1 which is provided with a protective cap 2 is die-bonded to the island 10.