| 摘要 |
PROBLEM TO BE SOLVED: To integrally form a printed circuit board and a fastener, and prevent influence by the thermal degradation by providing a solder part which connects a land part and the fastener of the printed circuit board and fixes the printed circuit board and the fastener. SOLUTION: When a circuit of a printed circuit board 6 is formed, cream solder 7c is printed at least on a part of a land part 6a. For example, the cream solder 7c is printed according to a diameter of the land part 6a, and a calking part 2b is formed on an outside fastener 2. In a manufacturing process of the printed circuit board, when an electronic part is mounted, reflow soldering is performed as a soldering process. When the cream solder 7c is melted by heating it at 200 deg.C or more at reflow soldering, the fastener 2 and the land part 6a can be integrally formed. Therefore, reduction in a plate thickness by the thermal degradation and the influence can be prevented. |
